Qualcomm launches the Snapdragon 8 Gen 2, the chip that will power the most powerful mobiles of 2023

Qualcomm Presents Most advanced processor for high-end mobile It offers a CPU with 35% more clock speed, improved artificial intelligence processing thanks to the Hexagon processor, and support for gaming technologies like ray tracing.

Snapdragon 8 Gen 2 will be available on Android phones From Honor, OnePlus, Sony, Xiaomi or Motorola (they will integrate it by the end of 2022).

CPU characteristics are based on a 64-bit architecture and consists of eight cores, The maximum frequency of the mains is 3.2 GHz; The performance of a group of three cores is 2.8 GHz; And meanwhile, the cluster of four cores is clocked at 2.0GHz.

The Snapdragon 8 Gen 2 chip has the following features,

  • Is Most advanced 5G platform From reality
  • It includes the Snapdragon X70 modem which is a 10 Gbps download speed,
  • Provides maximum WiFi performance 7 To accept uninterrupted connection.
  • It includes the first cognitive ISP that processes semantic image segmentation in real time.
  • It has an AV1 codec which is a Video playback up to 8K HDR at 60 frames per second.
  • It supports Samsung’s ISOCELL HP3 image sensor with 200 megapixels.

There’s also the Snapdragon 8 Gen 2 First INT4 compatible mobile platformAn AI accurate format with up to 60 percent performance/watt improvement for consistent estimation.

The first quantum computer may be available in 2025.

Others, Qualcomm Snapdragon Elite Gaming offers new featuressuch as real-time hardware-accelerated ray tracing that brings realism to gaming with enhanced lighting, reflections and illumination for an immersive experience.

Another novelty for players is that Will be able to experience photo-realistic human characters Thanks for the first mobile support optimized for the ‘Unreal Engine 5 Metahumans Framework’.

and with respect to security, The chip uses the Snapdragon Secure System It has isolation, cryptography and key management to protect users’ data and privacy.

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